DOTITE adhesive type

print

For All Types of Electronic Parts

DOTITE provides high performance electrically conductive adhesives designed for the microelectronics field. These adhesive materials can be used to replace soldering in applications where the materials for electronics internals can’t resist heat and solder can’t be used, and for mounting electronic devices on printed circuit boards (PCB/PWB), providing solutions to the issues that soldering and welding can’t. Our DOTITE lineup offers materials with excellent conductivity, adhesive strength, softness, and workability. We’ve developed a number of variations for different applications and production methods – including solvent and solventless types, low curing temperatures, and a range viscosities.

Product Chart

Product Name Volume Resistivity
(Ω・cm)		 Adhesion Strength
(N/mm2)		 Pyrolysis Temp.
(℃)*1		 Young’s Modulus
（GPa）*2		 Curing
Conditions		 Storage Thinner Application Method Features
FA-705BN 6×10-4 8 250 5 150℃,30mins. Refrigerated Solventless Screen printing,
Dispensing		 Useful for a wide variety of applications.
High contact conductivity.
XA-874 8×10-5 20 350 4 150℃,30mins. Frozen Solventless Screen printing,
Dispensing		 High heat resistance.
High adhesive strength.
Great performance in automotive applications. 
XA-910 4×10-4 20 350 7 100℃,60mins.
150℃,30mins.
180℃,7mins.		 Frozen Solventless Screen printing,
Dispensing		 Low temperature curing.
High heat resistance. 
XA-5617 4×10-3 15 340 3 200℃,10mins.
180℃,60mins.		 Frozen Solventless Metal mask/stencil printing Usable on tin (Sn) electrode.
AA07 2×10-4 12 300 0.9 150℃,60mins. Frozen Solventless Transfer,
Dispensing,
Screen printing		 Excellent softness.
XA-5905 4×10-4 45 360 5 150℃,60mins. Frozen Solventless Transfer,
Dispensing,
Screen printing		 High heat resistance.
High adhesive strength.
AA55 0.8×10-4 6 260 6 100℃,30mins. Component A/B:
A:Refrigerated
B:Refrigerated 		 SH thinner Transfer,
Dispensing		 2 Component type.
Low temperature curing.

*1 Measured by TGA, 1% weight reduction temperature in air

*2 Measured by DMS

The above products all meet European RoHS standards. The above values are representative values, and do not represent full product specifications

Conductive Adhesives for Crystal Devices

It is sometimes said that “Without DOTITE, this product would not exist.” Our lineup of DOTITE materials maintains a high market share in the crystal device industry, and we are proud of this distinguished history. These materials tightly integrate seemingly contradictory properties: softness and high adhesive strength – conductivity and high heat resistance – allowing us to answer our customers’ exacting demands. DOTITE has risen to the challenges of the crystal device industry, providing materials to respond to trends in ever smaller devices, and demands for higher precision and reliability.

Product Chart

Product Name Resin System Volume Resistivity (Ω・cm) Adhesive Strength Pyrolysis Temp. (℃）* Young's Modulus (MPa) Curing Conditions Storage Features
XA-500-2B Epoxy 9×10-5 3.0*1 300 1000 160℃, 30mins. Refrigerated Good softness.
FA-750 Epoxy, Urethane 3×10-4 3.0*1 345 500 150℃, 30mins. Refrigerated High reliability.
Good flexibility.
XA-819A Silicone 3×10-4 0.7*2 > 500 50 180℃, 60mins. Frozen Low out-gassing.
High heat resistance.
Good softness.
XA-5463 Silicone 1×10-4 1.4*2 > 500 200 180℃, 60mins. Frozen Small diameter application.
High heat resistance.
High adhesive strength.
FA-747 Silicone 1.5×10-4 1.2*2 > 500 200 200℃, 60mins. Refrigerated Small diameter application.
Low out-gassin.
XA-5940 Silicone 3×10-4 1.1*2 > 500 280 200℃, 60mins. Frozen Small diameter application.
Excellent performance at high temperatures.

*Based on the TGA method. 1% weight loss temperature in N2.

*1 DSTM-506 unit：N/mm2

*2 DSTM-510 unit：kgf

The above products all meet European RoHS standards. The above values are representative values, and do not represent full product specifications.