Membrane

Properties

DOTITE materials have good adhesion to a variety of substrates – including PET film, polyimide (PI) film, polycarbonate (PC), and other plastic substrates. DOTITE materials offer conformability to flexible substrates, bending resistance, high conductivity, and fine line printing – and they can be used with a variety of printing techniques. Additionally, DOTITE materials for electrical insulation for circuit protection, or adhesives for bonding film layers and mounting electrical components are available.

Applications

DOTITE materials are used for a wide variety of applications in multiple fields, including:
- Replacing FPC with a combination of FPC jumper circuitry and PET film membrane switches.
- Forming circuitry and electrodes for medical biosensors, wearable devices, and automotive sensors.
- Forming antennas for RFID (electronic tags), automotive transmitters, smart phones, and other mobile devices.
- Heating lines for defrosters, defoggers, and heaters.
- Replacement for resistive layers for circuitry.


Characteristics

Application Product Name Filler Volume Resistivity (Ω・cm) Curing Conditions Storage Applicable Substrates Features
Automotive sensor,
FPC jumper
FA-323 Ag 4×10-5 150℃, 10mins. Room Temp. PET, PI, Glass, PC※, Ceramic Excellent reliability.
Membrane switch FA-333 Ag 4×10-5 120℃, 10mins. Room Temp. PET, Glass, PC※, Ceramic Low temperature curing.
Good conductivity.
Membrane switch FA-345 Ag 4×10-5 150℃, 30mins. Refrigerated PET, Glass, PC※, Ceramic Fine line printing.
Excellent flexibility.
Membrane switch FA-353N Ag 4×10-5 150℃, 30mins. Room Temp. PET, Glass, Ceramic Good printability.
Excellent flexibility.
Printed antenna FA-451A Ag 2×10-5 150℃, 30mins. Room Temp. PET, Glass Low resistivity.
Used in automotive applications.
Printed antenna XA-3851 Ag 2×10-5 80℃, 30mins. Room Temp. PET, PC※ Can be adapted to PAD printing
with any applicable thinner.
Bio sensor XA-3513 Ag/AgCl 2×10-4 150℃, 30mins. Refrigerated PET Ag:AgCl ratio adjustment available.
Printed circuitry XA-3609 Ag 3×10-5 130℃, 30mins. Frozen PET, ITO, Glass For gravure offset printing,
flexo printing.
Circuit protection XC-3050 C 1×10-1 80℃, 30mins. Refrigerated PET Low temperature curing.
Good conductivity.
Circuit protection FC-415 C 1×10-1 140℃, 10mins. Refrigerated PET,PI Resistance to blocking.
Circuit protection,
Connector electrodes
FC-435 C 5×10-2 150℃, 30mins. Refrigerated PET For fine line printing.
Excellent resistance to abrasion.
SMD mounting XA-472 Ag 3×10-4 150℃, 30mins. Refrigerated PET Good conductivity.
Insulation and
Circuit protection
XB-3136 - - 150℃, 30mins. Room Temp. PET,PI For electrical insulation.
Excellent flexibility.
Membrane switch XB-114 - - 140℃, 10mins. Room Temp. PET Good printability.
Excellent anti-peeling on PET.
Potting XB-110 - - 80℃, 60mins. Room Temp. PET SMD reinforcement.

The above products all meet European RoHS standards. The above values are representative values, and do not represent full product specifications. Except where otherwise stated, these materials are designed for screen printing.
※ When used on some varieties of PC (polycarbonate) material, the solvents contained in DOTITE may cause discoloration or other defects. Confirming compatibility before use is recommended; materials designed for PC are also available.