Our product lineup consists of conductive and contact materials as well as sliding electrode forming materials that can be used in the "silver through-hole substrate," by which a double-sided board can be created at low cost out of the rigid printed wiring or circuit board, the so-called PWB or PCB, or can be used in the "silver jumper substrate" in which a double-layer board can be formed at low cost. Reliability and print-workability are maintained in good balance and we take pride in the high market share due to the adoption performances over many years.
|Major Application||Model No.||Filler||Volume Resistivity
|Curing Schedule||Storage Condition||Thinner||Features|
|Through-hole||FA-545||Ag||9×10-5||150℃ 30min.||Keep Refrigerated||A-thinner||Good resolution and thermal performance|
|Through-hole||XA-1079TF||Ag||2×10-4||150℃ 30min.||Keep Refrigerated||A-thinner||Good cost performance, Standard|
|VR electrode||XA-1083||Ag||2×10-4||180℃ 15min.||Keep Refrigerated||E-thinner||Good abrasion resistance|
|Electrode/cross-over||XC-223||C||3×10-2||150℃ 30min.||Keep Refrigerated||P-thinner||Good scratch resistance|
All of the product groups described above conform to the European RoHS regulation.
The numeric values described above are the representative values, and not the specified values.