Membrane

Intended use

It is a good adhesion to films, e.g., PET, PC, and polyimide enabling the production of low resistance circuits and contacts with high accuracy for the intended use of flat switches and FPC. It has excellent printing workability as well as flexibility and durability of conductive coatings. In addition, we have a rich product lineup that includes functional materials, e.g., insulation adhesives and laminating adhesives.


Characteristics

Major Application Model No. Filler Volume Resistivity (Ω・cm) Curing Schedule Storage Condition Thinner Features
Circuit FA-323 Ag 4×10-5 135℃ 10min. Room Temp. P-thinner High reliability
Circuit FA-333 Ag 4×10-5 120℃ 10min. Room Temp. P-thinner Low temperature curable and good conductivity
Circuit FA-353N Ag 4×10-5 150℃ 30min. Room Temp. P-thinner Good printability and folding property
Circuit FA-451A Ag 2×10-5 150℃ 30min. Room Temp. P-thinner Low resistance, antenna forming with performances and results
Circuit protection XC-3050 C 1×10-1 80℃ 30min. Keep Refrigerated P-thinner Low temperature curable and good conductivity
Circuit protection FC-415 C 1×10-1 140℃ 10min. Keep Refrigerated P-thinner Good blocking resistance
Circuit protection FC-435 C 5×10-2 150℃ 30min. Keep Refrigerated P-thinner Fine pattern and good scratch resistance
SDM adhesion XA-472 Ag 3×10-4 150℃ 30min. Keep Refrigerated P-thinner Good conductivity
Insulation XB-3136 - - 150℃ 30min. Room Temp. P-thinner Good insulation and folding properties
PET adhesion XB-114 - - 140℃ 10min. Room Temp. P-thinner Pressure sensitive adhesive
SMD reinforcement XB-110 - - 80℃ 60min. Room Temp. - Fixing for SMD

All of the product groups described above conform to the European RoHS regulation.
The numeric values described above are the representative values, and not the specified values.