For electromagnetic wave shield use

In the era of EMI/EMC, electroconductive resin materials are attracting industry's attention for their many merits as electromagnetic wave and magnet shields. DOTITE is expected for further expansion of applications of shields in equipment casing and electrical components, shield pattern forming for printed circuit boards, and others in the future for its excellent performance and total cost balance since it is blended into binder material that matches by selecting a filler of resistance value, from which the optimal shield effect is obtained.

Characteristics

Model No. Filler Volume Resistivity (Ω・cm) Curing/Drying Schedule Storage Condition Thinner Specific Gravity Flash Point (℃) Attenuation
(dB)*1
Applicable method Features
XA-9390 Ag 9×10-5 150℃ 30min. Keep Refrigerated A-thinner 2.0 68 60 to 90 Screen printing, spin coat High reliability, Good conductivity
XA-5713EE Ag 8×10-5 150℃ 30min. Frozen Solvent-free 2.5 4 60 to 90 Screen printing, printable under vacuum air condition Good printability
XA-9015 Ag 5×10-5 25℃ 3H.
100℃ 10min.
Room Temp. 9015-thinner 2.2 22 55 to 90 Paint by brush or spatula, spraying* Good conductivity
FE-107 Ag-Cu 5×10-4 25℃ 3H.
100℃ 10min.
Room Temp. #884 thinner 1.9 4 55 to 90 Paint by brush or spatula, spraying* To achieve both sufficient conductivity and cost
FN-101 Ni 5×10-3 25℃ 3H.
100℃ 10min.
Room Temp. #884 thinner 2.0 4 40 to 85 Paint by brush or spatula, spraying* Usable as paint with non-metallic color

*For spraying, we recommend diluting by thinner before using.

*1 Based on the KEC method (from 10 M to 1 GHz)

All of the product groups described above conform to the European RoHS regulation.
The numeric values described above are the representative values, and not the specified values.


For electrostatic shield use

In the midst of the electronization in progress, the impact of electrostatic noise will cause malfunctions to occur in the component and electronic circuit. Applying shield coating can reduce the impact of noise from the outside.

Characteristics

Model No. Binder Volume Resistivity (Ω・cm) Curing Schedule Applicable Substrate Thinner Features
Metal Urethane ABS Modified PPO PS PC Acrylic FRP PP
XC-12 One-pack type acrylic 10-2 25℃ 3H.
100℃ 10min.
    SP-2 thinner General purpose
XC-9064 Polyolefin 10-1 25℃ 3H.
100℃ 10min.
XC-32 thinner Good adhesion to PP under air drying
SH-3A Two-pack type epoxy 1 25℃ 24H.
100℃ 60min.
    SH thinner Low temperature curable 2-components coating. Usable with various substrates

*For spraying, we recommend diluting by thinner before using.

All of the product groups described above conform to the European RoHS regulation.
The numeric values described above are the representative values, and not the specified values.