DOTITE EMI Shield Type
EMI Shield
Properties
As we enter the era of EMI/EMC, the merits of using electrically conductive resin-based inks and paints as shields against electromagnetic waves and magnetic fields have become clear. DOTITE offers a variety of combinations of filler and resin binder to match with substrates, offering a shield material that balances cost with performance.
Applications
DOTITE EMI shield materials can be used on a variety of electronic devices to protect against sources of electromagnetic noise that can affect performance, movement, and precision of those devices.
- Shielding against common noise sources
Power supplies of motors, power semiconductors
RF semiconductors, such as for wi-fi and Bluetooth
Circuitry on PWB/FPC printed circuit boards
- Equipment that is vulnerable to the influence of noise interference
Smartphones, cell phones
Casings for medical devices, automotive parts, and measurement devices
Semiconductors and passive components for electronics
- Application
On the inside surfaces of equipment casings
On the external surfaces of semiconductor packaging
As a printed shield pattern on film substrates
Product Chart
| Product Name | Filler | Volume Resistivity (Ω・cm) | Curing/Drying Schedule | Storage | Thinner | Specific Gravity | Flash Point (℃) | Attenuation (dB)*1 |
Applicable method | Features |
|---|---|---|---|---|---|---|---|---|---|---|
| FA-323 | Ag | 4×10-5 | 135℃,10mins. | Room Temp. | P Thinner | 2.6 | 69 | 50-80 | Screen printing | Used as EMI shield on FPC. |
| XA-9390 | Ag | 9×10-5 | 150℃,30mins. | Refrigerated | A Thinner | 2.0 | 68 | 60-90 | Screen printing, Spin coat |
High reliability. Good conductivity. Used on smart phone semiconductors. |
| XA-5713EE | Ag | 8×10-5 | 150, 30mins. | Frozen | Solventless | 3.9 | 130 | 60-90 | Screen printing (incl. vacuum printing) |
Good printability. Used on wireless semiconductors. |
| XA-9015 | Ag | 5×10-5 | 25℃,3hrs. 100, 10mins. |
Room Temp. | 9015 thinner | 2.2 | 22 | 55-90 | Brush, Spatula, Spray gun* |
High reliability. Good conductivity. Good shield performance. |
| FE-107 | Ag-Cu | 5×10-4 | 25℃ ,3hrs. 100℃,10mins. |
Room Temp. | #884 thinner | 1.9 | 4 | 55-90 | Brush, Spatula, Spray gun* |
Good conductivity at low cost. Used on displays and measurement devices and other electronics cases. |
| FN-101 | Ni | 5×10-3 | 25℃ ,3hrs. 100℃,10mins. |
Room Temp. | #884 thinner | 2.0 | 4 | 40-85 | Brush, Spatula, Spray gun* |
Non-metallic color. Resists discoloration even when exposed. |
*Thinner is recommended when applying with spray gun or air brush.
*1 Measured by KEC (10MHz ~ 1GHz)
The above products all meet European RoHS standards. The above values are representative values, and do not represent full product specifications.
Electrostatic Shield
As electronics become more important, interference with electric circuitry and electronic parts caused by static electric noise and static induction is a common cause of malfunctions. By applying shield paints, static induction can be controlled, reducing the interference from external noise.
Product Chart
| Product Name | Resin System | Volume Resistivity （Ω・cm） | Drying Conditions | Applicable Substrates | Thinner | Features | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Metal | Urethane | ABS | Noryl/Xyron | PS | PC | Acrylic | FRP | PP | ||||||
| XC-9064 | Polyolefin | 10-1 | 25℃,3hrs. 100℃ 10mins. |
◯ | △ | ◯ | ◯ | ◯ | ◯ | ◯ | △ | ◯ | XC-32 Thinner | Air drying, for PP. Good adhesion on a variety of substrates. |
| SH-3A | 2-Component epoxy | 1 | 25℃,24hrs. 100℃,60mins. |
◯ | ◯ | ◯ | ◯ | ◯ | ◯ | △ | SH Thinner | Air temp. curing, 2 component paint. Good adhesion on a variety of substrates. |
||
*Thinner is recommended when applying with spray gun or air brush.
The above products all meet European RoHS standards. The above values are representative values, and do not represent full product specifications.