Product Information

What Is DOTITE®?

What Is DOTITE®?

DOTITE® is the brand name and general term for Fujikura Kasei’s electronics materials centered on conductive resin materials.
Because electrically conductive materials make up the core of the DOTITE® lineup, we refer to them collectively as our electronics materials.

What Is It?

Commonly referred to as “electrically conductive paste,” it is also known as “silver paste” because many of the raw materials used to impart electrical conductivity contain silver.
Generally, such materials are not conductive in paste form, but gain conductivity after going through the process of application and drying/curing to form a film.
Depending on their form and properties, they may also be called “electrically conductive adhesive,” “electrically conductive paint,” “silver ink,” and so on.

Choosing the Right DOTITE® Product

There is a wide range of product types under the DOTITE® label.
If you consider the four aspects listed below, it will be easier to determine which products are required.
Please review the catalog and the information below, and feel free to contact our Electronics Materials Division at any time if you have any questions or need assistance with product selection.

Electrical conductivity

We measure conductivity as volume resistivity (Ω·cm), which can be compared to other products or metals. For example, silver has a volume resistivity of 1.62×10−6 Ω·cm.

Application method

What is the application method? What shape will it be? Applicability, resolution (large or small area, fine line, etc.), and cost are major factors to consider.
If you have an application method in mind, selecting the appropriate viscosity is important.
If the application method has not been determined, the desired shape and resolution should be considered.

Target substrate

Check the material of the target substrate in order to determine the appropriate adhesion and drying/curing temperature of the conductive paste.
Regarding adhesion, the texture of the substrate surface may also be a factor.

Additional functions and applications

If you require any of the following, please contact us at the Electronics Materials Division. We will offer the best product for your intended use.

Adhesive

Brazing replacement, soldering replacement, etc.

Film durability/reliability

Environmental resistance, solvent resistance, abrasion resistance, bending resistance, etc.

Applications

Electrodes, circuitry jumper/crossovers, bump interconnects, etc.

General Precautions for Using DOTITE®

Be sure to mix thoroughly

Before use and/or after dilution, the DOTITE® material components may separate. Using a spatula or similar tool, be sure to mix the material thoroughly.
It is recommended to continue mixing for another 2–3 minutes after the material appears to be uniformly mixed.

Cleaning solvent for equipment after use

The appropriate cleaning solvent may be different depending on the product, so check the product information for the detailed cleaning procedure.

Other precautions

For other usage precautions, chemical composition, and hazard and toxicity information, see the material’s SDS documentation.

Contact

Please feel free to contact us if you have any questions about our company or products.

FAQs

Answers to common questions asked by our customers.