DOTITE® Conductive Resin Material | Product Information

Electrically Conductive Adhesives

Our adhesives are widely applicable for addressing challenges in soldering and welding, and we offer a diverse range of product lines to accommodate various application methods and materials.

Catalog for DOTITE® Electrically Conductive Adhesive
(in Japanese)

Products for Electronic Components

The product lines below are high-performance electrically conductive adhesives developed for the microelectronics field.
They can be used to solve a wide range of challenges in soldering and welding, such as to provide conductive bonding as a solder replacement where heat-sensitive are present in electronic components, or for mounting electronic components on printed boards (PCB/PWB).
Our lineup includes products with characteristics such as electrical conductivity, adhesive strength, heat resistance, and workability, and we offer a wide range of variations, including solvent-borne and solvent-free types, different curing conditions, viscosities, and more, tailored to specific applications and methods.

Product name (code)	Volume resistivity (Ω·cm)	Adhesive strength	Pyrolysis temp. (°C)	Young’s modulus	Curing conditions	Storage conditions	Thinner	Characteristics
FA-705BN	2×10-3	9 kgf (lead wire)	250^*1	5GPa^*3	150℃ 30min	Refrigerated	Solvent-free	Compatible with a wide range of applications, good contact resistance
XA-874	8×10-5	20N/mm2	350^*1	4GPa^*3	150℃ 30min	Frozen	Solvent-free	High heat resistance, high strength, extensively used in automotive applications
XA-910	4×10-4	20N/mm2	350^*1	7GPa^*3	100℃ 60min 150℃ 30min 180℃ 7min	Frozen	Solvent-free	Curable at low temperatures, high heat resistance
AA07	2×10-4	12N/mm2	300^*1	3GPa^*3	150℃ 60min	Frozen	Solvent-free	Excellent flexibility
AA2121-AN6	5×10-4	12N/mm2	335^*1	6GPa^*3	80℃ 60min	Frozen	Solvent-free	Curable at low temperatures, good storage stability
AA2119-G4	5×10-4	20N/mm2	–	–	80℃ 30min/70℃ 60min/60℃ 90min	Frozen	Solvent-free	Curable below 80℃
AA2201-A	6×10-4	5N/mm2	–	6GPa^*3	Hot plate 210℃ 1min (Oven 150℃ 30min also possible)	Frozen/refrigerated	Solvent-free	Capable of rapid curing, good storage stability
A-3N/C-3	2×10+1	9kgf (lead wire)	245^*1	1GPa^*3	150℃ 30min	Room temperature	Solvent-free	Dual-component, carbon conductive particles
XA-5651A	2×10-4	16N/mm2	345^*1	3GPa^*3	180°C, 60 min or reflow oven 200°C, 10 min	Frozen	–	Excellent reliability when used on tin electrodes
AA1221-G2-1	8×10-5	35N/mm2	360^*1	6GPa	150℃ 30min	Frozen	Solvent-free	Can be used on tin electrodes
XA-5905	3×10-4	40N/mm2	360^*1	5GPa^*3	150℃ 60min	Frozen	Solvent-free	High heat resistance, high strength
AA55	0.8×10-4	6N/mm2	260^*1	6GPa^*3	100℃ 30min	Liquid A: refrigerated Liquid B: refrigerated	SH Thinner	Dual-component, curable at low temperatures
FA-750	4×10-4	3N/mm2	345^*2	500MPa^*3	150℃ 30min	Refrigerated	–	High reliability, high flexibility Workability adjustable with dilution

Temperature at which 1% weight loss occurs in air, determined with thermogravimetric analysis.
Temperature at which 1% weight loss occurs in nitrogen, determined with thermogravimetric analysis.
Determined with dynamic mechanical spectroscopy.

All of the above product lines comply with the European RoHS Directive.
The above values are all representative values, and do not represent full product specifications.

Conductive Adhesives for Crystal Devices

Our widely used product lines dominate such a large share of the crystal device market that companies tell us, “We couldn’t have commercialized our products without DOTITE®.”
Combining conflicting qualities such as flexibility, conductivity, adhesive strength, and heat resistance, our products continue to meet our customers’ requirements.
Moreover, we offer a range of product lines tailored market trends such as advancements in component miniaturization and reliability.

Product name (code)	Resin	Volume resistivity (Ω·cm)	Adhesive strength	Pyrolysis temp. (°C)	Young’s modulus	Curing conditions	Storage conditions	Characteristics
XA-5243	Silicone	1.5×10-4	1.2^*2	500^*1	200MPa	200℃ 60min	Frozen	Extensive use in tuning fork crystal oscillators
AA1101-S	Silicone	1.5×10-4	1.0^*2	500^*1	130MPa	180℃ 60min	Frozen	Standard product

Temperature at which 1% weight loss occurs in nitrogen, determined with thermogravimetric analysis.
DSTM-510, unit: kgf

All of the above product lines comply with the European RoHS Directive.
The above values are all representative values, and do not represent full product specifications.

Circuitry, Electrode, and Connector Materials for PCBs

Applications

We offer a lineup of conductive and contact materials, as well as materials for sliding electrodes, that can be used in rigid printed boards (PWBs and PCBs). These include materials for inexpensive double-sided “silver through-hole boards,” as well as “silver jumper boards,” which provide a simple and inexpensive way to create two-layer boards.
These materials combine reliability and printability in a well-balanced manner, and boast a high market share with a long history of adoption.

Product name (code)	Applications	Filler	Volume resistivity (Ω·cm)	Curing conditions	Storage conditions	Thinner	Features
XA-1079TF	For through holes	Ag	2×10-4	150℃ 30min.	Refrigerated	A Thinner	Cost-effective standard product
XC-223	For contacts/jumpers	C	3×10-2	150℃ 30min.	Refrigerated	P Thinner	Good durability

All of the above product lines comply with the European RoHS Directive.
The above values are all representative values, and do not represent full product specifications.

Materials for Printed Electronics (PE)

Characteristics

These products offer a diverse range of functional qualities, including adhesion to various plastic materials such as PET films, polyimide (PI) films, and polycarbonate (PC), as well as flexural resilience and conformability to flexible materials. In addition, they can offer low resistance values, high-precision printability, and compatibility with a wide range of printing methods.
Besides conductive materials, we also offer protective insulating materials, pressure-sensitive adhesives for film lamination, and adhesives for mounting components.

Applications

Replacing FPCs with a combination of FPC jumper circuitry and PET film membrane switches

Forming circuitry and electrodes for biomedical sensors, wearable devices, and automotive sensors

Forming antennas for RFID (electronic) tags, automotive transmitters, smart phones, and other mobile devices

Heating lines of planar heating elements for defoggers, heaters, etc.

Replacement for resistive layers for circuitry

Screen Printing

Product name (code)	Applications	Filler	Volume resistivity	Curing conditions	Storage conditions	Compatible substrates	Features
FA-323	Automotive sensors FPC jumpers	Ag	≤4.0×10−5 Ω·cm	150℃10min	Room temperature	PET, PI, glass	Excellent reliability
XA-3992	FPC replacement	Ag	4.5×10−5 Ω·cm	150℃30min	Refrigerated	PET, PI, glass	Polyimide (PI) film Good adhesion
FA-333	Membrane switches	Ag	≤4.0×10−5 Ω·cm	120℃ 10min.	Room temperature	PET, glass	Curable at low temperatures, good conductivity
FA-345	Membrane switches	Ag	≤6.0×10−5 Ω·cm	150℃30min	Refrigerated	PET, glass	Suitable for high-resolution printing, excellent flexural resilience
FA-353N	Membrane switches	Ag	≤5.0×10−5 Ω·cm	150℃30min	Refrigerated	PET, glass	Good printability, excellent flexural resilience
XA-3927	Membrane switches	Ag	4.2×10−5 Ω·cm	150℃30min	Refrigerated	PET, glass	Low resistivity, excellent flexural resilience
FA-451A	Antenna formation	Ag	≤3.0×10−5 Ω·cm	150℃30min	Room temperature	PET, glass	Low resistivity, used in automotive applications
XA-3513	Biomedical sensors	Ag/AgCl	≤5.0×10−4 Ω·cm	150℃30min	Refrigerated	PET	Ag: AgCl ratio adjustment available
XA-3737	Capacitive touch switches	Ag	1.0×10^−4 Ω·cm	125℃30min	Refrigerated	PC	Can be molded after printing and curing, ideal for in-mold electronics circuitry, good stretchability
XA-3993	Plating substrate	Ag	4.0×10−5 Ω·cm	120℃30min	Room temperature	PET	Permits formation of plated electrodes with electroless plating, enabling components to be mounted with solder
XC-3236	Circuit protection, connector electrodes	C	1 kΩ/□ (sheet resistance)	150℃30min	Refrigerated	PET, glass	C paste for resistor formation, retains resistance to sliding wear
XC-3237	Circuit protection, connector electrodes	C	20 kΩ/□ (sheet resistance)	150℃30min	Refrigerated	PET, glass	C paste for resistor formation, retains resistance to sliding wear
XC-3050	Circuit protection	C	≤1.0×10−1 Ω·cm	80℃30min	Refrigerated	PET	Curable at low temperatures, good conductivity
FC-415	Circuit protection	C	≤2.0×10−1 Ω·cm	150℃20min	Refrigerated	PET, PI	Good anti-blocking performance
FC-435	Circuit protection, connector electrodes	C	≤1.0×10−1 Ω·cm	150℃30min	Refrigerated	PET	Suitable for fine line printing, excellent abrasion resistance

When used on some varieties of polycarbonate (PC) material, the solvents contained in DOTITE® may cause discoloration or other defects. Confirming compatibility before use is recommended;
materials designed for PC are also available.

All of the above product lines comply with the European RoHS Directive.
The above values are all representative values, and do not represent full product specifications.
Unless otherwise specified, the above products are designed to be suitable for screen printing.

Diverse Printing Technologies

Product name (code)	Applications	Filler	Volume resistivity (Ω·cm)	Curing conditions	Storage conditions	Compatible substrates	Features
XA-3851	Antenna formation	Ag	2×10-5	80℃ 30min.	Room temperature	PET, PC^*	Can be used for pad printing after dilution with special thinners
XA-4004	Antenna formation	Ag	1.8×10-5	120℃10min	Refrigerated	PET	Standard product for gravure printing Can also dry at room temperature
XA-3609	Printed circuits	Ag	3×10-5	130℃ 30min.	Frozen	PET, ITO glass	Standard product for gravure offset/ flexography printing

When used on some varieties of polycarbonate (PC) material, the solvents contained in DOTITE® may cause discoloration or other defects. Confirming compatibility before use is recommended; materials designed for PC are also available.

All of the above product lines comply with the European RoHS Directive.
The above values are all representative values, and do not represent full product specifications.
Unless otherwise specified, the above products are designed to be suitable for screen printing.

Auxiliary Materials

Product name (code)	Applications	Filler	Volume resistivity (Ω·cm)	Curing conditions	Storage conditions	Compatible substrates	Features
XA-472	SMD mounting	Ag	3×10-4	150℃ 30min.	Refrigerated	PET	Good conductivity
XB-3136	Insulation, circuit protection	–	–	150℃ 30min.	Room temperature	PET, PI	Good insulation properties and flexural resilience
XB-114	Membrane switches	–	–	140℃ 10min.	Room temperature	PET	Good printability, good holding power between PET layers
XB-110	Potting	–	–	80℃ 60min.	Room temperature	PET	SMD reinforcement

When used on some varieties of polycarbonate (PC) material, the solvents contained in DOTITE® may cause discoloration or other defects. Confirming compatibility before use is recommended;
materials designed for PC are also available.

All of the above product lines comply with the European RoHS Directive.
The above values are all representative values, and do not represent full product specifications.
Unless otherwise specified, the above products are designed to be suitable for screen printing.

Circuitry and Insulating Paste Materials for Touch Panels

Electrically conductive pastes suitable for fine line printing as an ITO film replacement or for narrow bezel applications.
We offer insulating pastes for a diverse range of uses.

Paste Materials for Touch Panel Circuitry

We provide circuitry and insulating paste materials for resistive touch panels, a widely used and proven technology. We also offer ITO replacements for capacitive touch panels such as those commonly found in smart phones and other mobile devices, as well as electrically conductive paste materials suitable for use in fine-line circuit printing techniques for narrow-bezel purposes.

Product name (code)	Volume resistivity (Ω·cm)	Curing conditions	Storage conditions	Thinner	Applicable methods	Features
FA-410	10×10-5	140℃ 20min^* 80℃ 30min	Refrigerated	SC-0030 Thinner	Screen printing	For use on ITO films. Suitable for low-temperature drying. Used in resistive touch screens.
XA-436	7×10-5	150℃ 30min	Refrigerated	P Thinner	Screen printing	For ITO glass substrates. Extensively used in applications where high reliability is essential.
XA-3972	10.0×10-5 or less	140℃ 20min	Refrigerated	SC-0030 Thinner	Screen printing	Good adhesion on ITO glass and ITO films
XA-3609	3×10-5	130℃ 30min	Frozen	SC-0024 Thinner	Gravure offset printing	For high-resolution printing as an ITO replacement
XA-3512	5×10-5	140℃ 20min^* 130℃ 10min	Refrigerated	SC-0030 Thinner	Screen printing	Good printability

We recommend these for applications where coating durability, including resistance to salt spray, abrasion, etc., is particularly required.

All of the above product lines comply with the European RoHS Directive.
The above values are all representative values, and do not represent full product specifications.

Paste Materials for Touch Panel Circuitry

Starting with DOTITE® SN-8400C, which has an outstanding track record as an insulating material for touch panels, we offer a range of products with various functionalities, including high-transparency resist insulation and protective material.

Product name (code)	Appearance	Curing conditions	Insulation resistance	Storage conditions	Features
XB-3253	Transparent	150℃ 30min	≥1,012 Ω	Cool, dark place at room temperature	Excellent transparency
SN-8400C	White	≥800 mj/cm2 (cumulative)	≥1,012 Ω	Room temperature (30°C or below)	Extensively used

All of the above product lines comply with the European RoHS Directive.
The above values are all representative values, and do not represent full product specifications.

Room Temperature Drying Type

Doesn’t the name “DOTITE®” bring this type to mind? That’s how widely this series is used.

Applications

This type dries at room temperature, and is particularly effective for materials like plastics that cannot be heated after application.
These are widely used for applications such as enhancing the conductivity of screws and rivets, providing simple conductive adhesion for fixing SEM samples, repairing circuits, and providing a substrate for electroplating.

Product name (code)	Volume resistivity (Ω·cm)	Drying conditions	Storage conditions	Thinner	Applicable methods	Features
D-362	7×10-4	25℃ 3H. 100℃ 30min.	Room temperature	S Thinner, SP-2 Thinner, toluene	Paintbrush, spatula, spraying, dispensing^*	Quick drying, good adhesive properties, enhances screws and rivets
D-500	8×10-5	25℃ 3H. 100℃ 30min.	Room temperature	S Thinner, SP-2 Thinner, toluene	Paintbrush, spatula, spraying^*	Good conductivity
D-550	1×10-4	25℃ 1H. 100℃ 5min.	Room temperature	S Thinner, SP-2 Thinner, toluene	Paintbrush, spatula, spraying^*	Extensively used for fixing SEM samples

For spraying, we recommend diluting with thinner before use.

All of the above product lines comply with the European RoHS Directive.
The above values are all representative values, and do not represent full product specifications.

EMI Shield Type

These can be applied using paint brushes or spray guns, or with screen printing (including vacuum printing), and can shield against interference ranging from the kHz to the GHz bands.

Catalog for DOTITE® Magnetic Shield (in Japanese)

EMI Shielding

Characteristics

As we enter an era of full-blown EMI/EMC, the merits of using electrically conductive inks and coatings as electromagnetic shielding are gaining attention.
DOTITE® offers a wide range of shielding materials that provide an excellent balance of cost and performance by combining selected binders matched to substrates with conductive fillers that impart optimal shielding properties.

Applications

Shielding against common noise sources

Power supplies of motors, power semiconductors; RF semiconductors such as for Wi-Fi and Bluetooth; circuitry on PWB/FPC printed circuit boards

Equipment vulnerable to noise interference

Smartphones, cell phones; casings for medical devices, automotive parts, and measurement devices; semiconductors and passive components for electronics; circuitry for PWB/FPC printed circuit boards

Application areas

Inside surfaces of device casings, outside surfaces of semiconductor packages

As a printed shield pattern on film substrates

Product name (code)	Filler	Volume resistivity (Ω·cm)	Curing/drying conditions	Storage conditions	Thinner	Specific gravity	Flash point (°C)	Attenuation (dB)^*1	Applicable methods	Features
FA-323	Ag	4×10-5	135℃ 10min.	Room temperature	P Thinner	2.6	69	50～80	Screen printing	Used in EMI shielding for FPCs
XA-1107	Ag	9×10-5	150℃ 30min.	Refrigerated	SH Thinner	1.8-2.2	71	55～90	Paintbrush, spatula, spraying^*	High reliability, good conductivity, used with smartphone semiconductors
XA-5713EE	Ag	8×10-5	150℃ 30min.	Frozen	Solvent-free	3.9	130	60～90	Screen printing (suitable for vacuum printing)	Good vacuum printability, used in wireless semiconductors
XA-9015	Ag	5×10-5	25℃ 3H. 100℃ 10min.	Room temperature	9015 Thinner	2.2	22	55～90	Paintbrush, spatula, spraying^*	High reliability, good conductivity, good shielding effect, toluene-free
FE-107	Ag-Cu	5×10-4	25℃ 3H. 100℃ 10min.	Room temperature	#884 Thinner	1.9	4	55～90	Paintbrush, spatula, spraying^*	Good conductivity, low cost. Used widely in displays, measuring devices, etc.
FN-101	Ni	5×10-3	25℃ 3H. 100℃ 10min.	Room temperature	#884 Thinner	2	4	40～85	Paintbrush, spatula, spraying^*	Non-metallic color in appearance, used in exposed applications for its resistance to discoloration
XA-5905	Ag	3×10-4	150℃ 60min	Frozen	Solvent-free	3.5	130	–	Dispensing, transfer printing	Connecting and bonding semiconductor packages to circuit boards

For spraying, we recommend diluting with thinner before use.

*1 Measured with the KEC method (10 MHz to 1 GHz).

All of the above product lines comply with the European RoHS Directive.
The above values are all representative values, and do not represent full product specifications.

Electrostatic Shield

While electronics are becoming increasingly ubiquitous, interference with electric circuitry and electronic parts caused by electrostatic noise and induction can still be a cause of malfunctions.
By applying shield paints, static induction can be controlled, reducing interference from external noise.

Product name (code)	Resin	Volume resistivity (Ω·cm)	Drying conditions	Applicable substrates									Thinner	Features
Product name (code)	Resin	Volume resistivity (Ω·cm)	Drying conditions	Metal	Urethane	ABS	NORYL/ XYRON	PS	PC	Acrylic	FRP	PP	Thinner	Features
XC-9064	Polyolefin	10-1	25℃ 3H. 100℃ 10min.	◯	△	◯	◯	◯	◯	◯	△	◯	XC-32 Thinner	Dries in air, adheres well to a variety of substrates including PP
SH-3A	2-component epoxy	1	25℃ 24H. 100℃ 60min.	◯	◯	–	◯	◯	–	◯	◯	△	SH Thinner	Dual-component coating, cures at room temperature, adheres to a variety of substrates

For spraying, we recommend diluting with thinner before use.

All of the above product lines comply with the European RoHS Directive.
The above values are all representative values, and do not represent full product specifications.