For All Types of Electronic Parts
DOTITE provides high performance electrically conductive adhesives designed for the microelectronics field. These adhesive materials can be used to replace soldering in applications where the materials for electronics internals can’t resist heat and solder can’t be used, and for mounting electronic devices on printed circuit boards (PCB/PWB), providing solutions to the issues that soldering and welding can’t. Our DOTITE lineup offers materials with excellent conductivity, adhesive strength, softness, and workability. We’ve developed a number of variations for different applications and production methods – including solvent and solventless types, low curing temperatures, and a range viscosities.
Product Chart
Product Name | Volume Resistivity (Ω・cm) |
Adhesion Strength (N/mm2) |
Pyrolysis Temp. (℃)*1 |
Young’s Modulus (GPa)*2 |
Curing Conditions |
Storage | Thinner | Application Method | Features |
---|---|---|---|---|---|---|---|---|---|
FA-705BN | 6×10-4 | 8 | 250 | 5 | 150℃,30mins. | Refrigerated | Solventless | Screen printing, Dispensing |
Useful for a wide variety of applications. High contact conductivity. |
XA-874 | 8×10-5 | 20 | 350 | 4 | 150℃,30mins. | Frozen | Solventless | Screen printing, Dispensing |
High heat resistance. High adhesive strength. Great performance in automotive applications. |
XA-910 | 4×10-4 | 20 | 350 | 7 | 100℃,60mins. 150℃,30mins. 180℃,7mins. |
Frozen | Solventless | Screen printing, Dispensing |
Low temperature curing. High heat resistance. |
XA-5617 | 4×10-3 | 15 | 340 | 3 | 200℃,10mins. 180℃,60mins. |
Frozen | Solventless | Metal mask/stencil printing | Usable on tin (Sn) electrode. |
AA07 | 2×10-4 | 12 | 300 | 0.9 | 150℃,60mins. | Frozen | Solventless | Transfer, Dispensing, Screen printing |
Excellent softness. |
XA-5905 | 4×10-4 | 45 | 360 | 5 | 150℃,60mins. | Frozen | Solventless | Transfer, Dispensing, Screen printing |
High heat resistance. High adhesive strength. |
AA55 | 0.8×10-4 | 6 | 260 | 6 | 100℃,30mins. | Component A/B: A:Refrigerated B:Refrigerated |
SH thinner | Transfer, Dispensing |
2 Component type. Low temperature curing. |
*1 Measured by TGA, 1% weight reduction temperature in air
*2 Measured by DMS
The above products all meet European RoHS standards. The above values are representative values, and do not represent full product specifications
Conductive Adhesives for Crystal Devices
It is sometimes said that “Without DOTITE, this product would not exist.” Our lineup of DOTITE materials maintains a high market share in the crystal device industry, and we are proud of this distinguished history. These materials tightly integrate seemingly contradictory properties: softness and high adhesive strength – conductivity and high heat resistance – allowing us to answer our customers’ exacting demands. DOTITE has risen to the challenges of the crystal device industry, providing materials to respond to trends in ever smaller devices, and demands for higher precision and reliability.
Product Chart
Product Name | Resin System | Volume Resistivity (Ω・cm) | Adhesive Strength | Pyrolysis Temp. (℃)* | Young's Modulus (MPa) | Curing Conditions | Storage | Features |
---|---|---|---|---|---|---|---|---|
XA-500-2B | Epoxy | 9×10-5 | 3.0*1 | 300 | 1000 | 160℃, 30mins. | Refrigerated | Good softness. |
FA-750 | Epoxy, Urethane | 3×10-4 | 3.0*1 | 345 | 500 | 150℃, 30mins. | Refrigerated | High reliability. Good flexibility. |
XA-819A | Silicone | 3×10-4 | 0.7*2 | > 500 | 50 | 180℃, 60mins. | Frozen | Low out-gassing. High heat resistance. Good softness. |
XA-5463 | Silicone | 1×10-4 | 1.4*2 | > 500 | 200 | 180℃, 60mins. | Frozen | Small diameter application. High heat resistance. High adhesive strength. |
FA-747 | Silicone | 1.5×10-4 | 1.2*2 | > 500 | 200 | 200℃, 60mins. | Refrigerated | Small diameter application. Low out-gassin. |
XA-5940 | Silicone | 3×10-4 | 1.1*2 | > 500 | 280 | 200℃, 60mins. | Frozen | Small diameter application. Excellent performance at high temperatures. |
*Based on the TGA method. 1% weight loss temperature in N2.
*1 DSTM-506 unit:N/mm2
*2 DSTM-510 unit:kgf
The above products all meet European RoHS standards. The above values are representative values, and do not represent full product specifications.