For various types of electronic components

This electrically-conductive adhesive with high functionality was developed for the microelectronics field. It can be widely utilized for conductive adhesion for the materials without high temperature resistance, and as solutions for welding and soldering problems. Rolling out to the various variations according to the applications and works, e.g., solvent/solvent-free, curing conditions, viscosity, and others after satisfying all of the basic characteristics, e.g., conductivity, adhesive strength, heat-resistance, dispense characteristics, and others at a high level.

Characteristics

Model No. Volume Resistivity
(Ω・cm)
Adhesion Strength
(N/mm2)
Thermolysis temperature
(℃)*1
Young's modulus
(GPa)*2
Curing
Schedule
Storage Condition Thinner Applicable method Features
FA-705BN 6×10-4 8 250 5 150℃ 30min Keep Refrigerated Solventless Screen printing,
dispensing
Wide usage,
Excellent ohmic contact.
XA-874 8×10-5 20 350 4 150℃ 30min Frozen Solventless Screen printing,
dispensing
Excellent heat resistance
and high adhesion
XA-910 4×10-4 20 350 7 100℃ 60min
150℃ 30min
180℃ 7min
Frozen Solventless Screen printing,
dispensing
Low temperature curable,
Excellent heat resistance
XA-5617 4×10-3 15 340 3 200℃ 10min Frozen Solventless Stencil mask printing Good adhesion to tin electrode
AA07 2×10-4 12 300 0.9 150℃ 60min Frozen Solventless Transfer process,
dispensing, screen printing
Good flexibility
XA-5905 4×10-4 45 360 5 150℃ 60min Frozen Solventless Transfer process,
dispensing, screen printing
Excellent heat resistance
and high adhesion
AA55 0.8×10-4 6 260 6 100℃ 30min Solution A: Room Temp.
Solution B: Keep Refrigerated
SH thinner Transfer process,
dispensing
2 components,
Low temperature curable

*1 Based on the TGA method. 1% weight loss temperature in Air.

*2 Based on the DMS method.

All of the product groups described above conform to the European RoHS regulation.
The numeric values described above are the representative values, and not the specified values.


Conductive adhesive for crystal device

The product group with excellent performances and results that takes pride in its high market share, thus eliciting the following response: "It is impossible to realize this product without DOTITE." It features contradictory elements of flexibility, conductivity, adhesive strength, and heat resistance, in order to keep responding to customers' requests.
We also have a lineup of products that respond to the market trend of parts minimization and high reliability .

Characteristics

Model No. Binder Volume Resistivity (Ω・cm) Adhesion Strength Thermolysis temperature (℃)* Young's modulus (MPa) Curing Schedule Storage Condition Features
XA-500-2B Epoxy 9×10-5 3.0*1 300 1000 160℃ 30min Keep Refrigerated Good flexibility
FA-750 Epoxy-urethane 3×10-4 3.0*1 345 500 150℃ 30min Keep Refrigerated High reliability, Good flexibility
XA-819A Silicone 3×10-4 0.7*2 > 500 50 180℃ 60min Frozen Low out gas, Good heat resistance and flexibility
XA-5463 Silicone 1×10-4 1.4*2 > 500 200 180℃ 60min Frozen Possible to apply with a small diameter needle, Good heat resistance and high adhesion
FA-747 Silicone 1.5×10-4 1.2*2 > 500 200 200℃ 60min Keep Refrigerated Possible to apply with a small diameter needle, Good heat resistance and low out gas
XA-5940 Silicone 3×10-4 1.1*2 > 500 280 200℃ 60min Frozen Possible to apply with a small diameter needle and good performance at high temp

*Based on the TGA method. 1% weight loss temperature in N2.

*1 DSTM-506 unit:N/mm2

*2 DSTM-510 unit:kgf

All of the product groups described above conform to the European RoHS regulation.
The numeric values described above are the representative values, and not the specified values.